Xforce [CRACKED]keygenShowcase2014x86x64 ⚓
This invention relates to a shielded module of an electronic apparatus, and more particularly to a shielded module which electrically shields low frequency signals from high frequency signals to be inputted or outputted in and from the shielded module.
In recent years, automobiles using semiconductor circuit parts such as a semiconductor integrated circuit and a resistor for an electric power control switch, etc., have been in the process of being developed. Furthermore, to meet the requirements of the growing size and weight of the electric cars and so on, the semiconductor circuits are mounted on a printed circuit board as compact as possible. Therefore, in order to allow the semiconductor circuits to be miniaturized and the circuit board to be miniaturized, it is desired that a multiple of the miniature semiconductor circuits be densely mounted on the printed circuit board.
However, the increasing number of miniature semiconductor circuits formed on a semiconductor wafer causes electromagnetic induction noise, electromagnetic noise, etc., thereby generating a problem that the semiconductor circuits become unstable. To resolve such problems, Japanese Patent Application No. Hei 9-217431 discloses the shielded module of the semiconductor device.
The shielded module disclosed in the Japanese Patent Application No. Hei 9-217431 comprises a first shielding member formed of a resin material, a printed circuit board, a second shielding member, and a shielding connecting member. The first shielding member is formed of a resin material having a thickness, with an opening, which is the same as that of the opening of a frame formed of the second shielding member. The printed circuit board is disposed within the frame, and has a first circuit pattern formed thereon. The second shielding member covers the printed circuit board, and is formed of a resin material. The shielding connecting member electrically connects the first shielding member and the second shielding member together.
In the shielded module, as shown in FIG. 9, the frame 13 with a rectangular shape formed of a metal plate is secured to the bottom of a base member 11 with a rectangular shape formed of the metal plate. The printed circuit board 12 is disposed to the frame 13, and is electrically connected to and fixed to the base member 11 with screws 14a, 14b, etc. The first shielding member 15 with a rectangular shape is secured to the upper surface of the base member 11. The second shielding member 16 with a rectangular shape is secured to the upper